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The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked...
Search relevance: 1.00 | Views last month: 2 | Catalog Last Checked: September 10, 2026 at 05:52 PM -
The data are associated with figures in A. P. Kotula, R. Tao, J. Tu, Y. Lee, G. A. Holmes, Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic...
Search relevance: 1.00 | Views last month: 1 | Catalog Last Checked: September 10, 2026 at 05:53 PM -
This publication contains the data presented in the associated proceeding paper ”Pushing the Envelope in Mechanical Characterization of Copper in Hybrid-Bonding Patterns for Advanced Packaging:...
Search relevance: 1.00 | Views last month: 0 | Catalog Last Checked: September 10, 2026 at 05:53 PM -
The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked...
Search relevance: 1.00 | Views last month: 0 | Catalog Last Checked: October 02, 2026 at 07:53 PM -
The data are associated with figures in A. P. Kotula, R. Tao, J. Tu, Y. Lee, G. A. Holmes, Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic...
Search relevance: 1.00 | Views last month: 0 | Catalog Last Checked: October 02, 2026 at 07:53 PM -
This publication contains the data presented in the associated proceeding paper ”Pushing the Envelope in Mechanical Characterization of Copper in Hybrid-Bonding Patterns for Advanced Packaging:...
Search relevance: 1.00 | Views last month: 0 | Catalog Last Checked: October 02, 2026 at 07:54 PM
