Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant
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11 resources available
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CHIPS-AWACKSM Data Repository Explorer (CADRE)
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Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| bureauCode |
[ "006:55" ] |
| contactPoint |
{ "fn": "Anthony Kotula", "hasEmail": "mailto:anthony.kotula@nist.gov" } |
| description | The data are associated with figures in A. P. Kotula, R. Tao, J. Tu, Y. Lee, G. A. Holmes, Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Texas, May 27 - 30, 2025. |
| distribution |
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| identifier | ark:/88434/mds2-3702 |
| issued | 2025-05-15 |
| keyword |
[ "CHIPS metrology", "advanced packaging", "cure kinetics", "microelectronics encapsulation", "optoelectronics", "rheology" ] |
| landingPage | https://data.nist.gov/od/id/mds2-3702 |
| language |
[ "en" ] |
| license | https://www.nist.gov/open/license |
| modified | 2025-02-10 00:00:00 |
| programCode |
[ "006:045" ] |
| publisher |
{ "name": "National Institute of Standards and Technology", "@type": "org:Organization" } |
| theme |
[ "Chemistry:Analytical chemistry", "Chemistry:Chemical engineering and processing", "Chemistry:Chemical thermodynamics and chemical properties", "Chemistry:Thermochemical properties", "Materials:Composites", "Materials:Materials characterization", "Materials:Polymers", "Metrology:Optical, photometry, and laser metrology" ] |
| title | Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant |
