{"@type": "dcat:Dataset", "accessLevel": "public", "bureauCode": ["006:55"], "contactPoint": {"fn": "Anthony Kotula", "hasEmail": "mailto:anthony.kotula@nist.gov"}, "description": "The data are associated with figures in A. P. Kotula, R. Tao, J. Tu, Y. Lee, G. A. Holmes, Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Texas, May 27 - 30, 2025.", "distribution": [{"accessURL": "https://pages.nist.gov/CHIPS-AWACKSM-data", "description": "The CADRE website provides an access point to the project\u2019s published datasets. It aims to provide researchers a means to quickly understand the scope of the work and explore data relevant to semiconductor packaging materials and processing.", "title": "CHIPS-AWACKSM Data Repository Explorer (CADRE)"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-3702/3702_README.txt", "mediaType": "text/plain"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-3702/3702_README.txt.sha256", "mediaType": "text/plain"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-3702/Figure_5-Normalized_IR_absorbance.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-3702/Figure_5-Normalized_IR_absorbance.xlsx.sha256", "mediaType": "text/plain"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-3702/Figure%201-Conversion%20rate.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-3702/Figure%202-Conversion.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-3702/Figure%203-Residue%20heat.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-3702/Figure%204-FTIR%20spectra.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-3702/Figure%206-Raman%20spectra.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-3702/Figure%207-Rheo-Raman%20data.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}], "identifier": "ark:/88434/mds2-3702", "issued": "2025-05-15", "keyword": ["CHIPS metrology", "advanced packaging", "cure kinetics", "microelectronics encapsulation", "optoelectronics", "rheology"], "landingPage": "https://data.nist.gov/od/id/mds2-3702", "language": ["en"], "license": "https://www.nist.gov/open/license", "modified": "2025-02-10 00:00:00", "programCode": ["006:045"], "publisher": {"@type": "org:Organization", "name": "National Institute of Standards and Technology"}, "theme": ["Chemistry:Analytical chemistry", "Chemistry:Chemical engineering and processing", "Chemistry:Chemical thermodynamics and chemical properties", "Chemistry:Thermochemical properties", "Materials:Composites", "Materials:Materials characterization", "Materials:Polymers", "Metrology:Optical, photometry, and laser metrology"], "title": "Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant"}