Elastic-plastic AFM indentation on copper
Dataset from AFM single-step and multi-step indentations performed on hybrid-bonding copper patterns at room temperature
Resources
6 resources available
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Data for Figure 3
CSV -
Data for Figure 4
CSV -
Data for Figure 2
CSV -
Data for Figure 5
CSV -
Data for Figure 1
CSV -
3867_README
TXT
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Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| bureauCode |
[ "006:55" ] |
| contactPoint |
{ "fn": "Gheorghe Stan", "hasEmail": "mailto:gheorghe.stan@nist.gov" } |
| description | Dataset from AFM single-step and multi-step indentations performed on hybrid-bonding copper patterns at room temperature |
| distribution |
[ { "title": "Data for Figure 3", "format": "csv", "mediaType": "text/csv", "description": "AFM single-step indentation characterization on Cu pads. (a) Characteristic force-displacement curve; (b) Average force-indentation depth curves, with one standard deviation; (c) Histogram fits for plastic metrics: number of pop-ins per indentation curve, plasticity index, cumulative excursion length, and plastic work; (d) Empirical cumulative distribution (ecdf) of maximum shear stress at the first pop-in event.", "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/Data_Figure_3.csv" }, { "title": "Data for Figure 4", "format": "csv", "mediaType": "text/csv", "description": "AFM single-step indentation comparison of grain boundary (GBdry) and grain interior (GInt) plasticity. (i) Average force-indentation depth curves; (ii) Histogram fits for plastic metrics (number of pop-ins per indentation curve, plasticity index, cumulative excursion length, plastic work); (iii) Empirical cumulative distribution (ecdf) of maximum shear stress at fist pop-in.", "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/Data_Figure_4.csv" }, { "title": "Data for Figure 2", "format": "csv", "mediaType": "text/csv", "description": "CR-AFM measurements. (i) Indentation moduli over SiO2 and Cu regions as determined from CR-AFM mapping; (ii) Cross-section along the dashed line in (i); (iii) Histogram of the indentation moduli from the map shown in (a).", "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/Data_Figure_2.csv" }, { "title": "Data for Figure 5", "format": "csv", "mediaType": "text/csv", "description": "Multi-step AFM-indentation experiments. (i) Topographic line scan covering two indents within a Cu pad; (ii) A subset of force-indentation depth curves with the Hertzian fits superimposed on the unloading segments; (iii) Indentation stress-strain curve with stress-strain pairs from all experiments; (iv) Empirical cumulative distribution function of the indentation yield stress from all the experiments; (v) Average force-depth envelope curve for multi-step indentation experiments.", "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/Data_Figure_5.csv" }, { "title": "Data for Figure 1", "format": "csv", "mediaType": "text/csv", "description": "Representative experimental curves obtained by i) Contact Resonance AFM (CR-AFM), ii) single-step, and iii) multi-step AFM indentation.", "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/Data_Figure_1.csv" }, { "title": "3867_README", "mediaType": "text/plain", "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/3867_README.txt" } ] |
| identifier | ark:/88434/mds2-3867 |
| issued | 2025-08-21 |
| keyword |
[ "AFM", "advanced packaging", "contact resonance", "copper", "hybrid bonding", "indentation", "nanoscale plasticity" ] |
| landingPage | https://data.nist.gov/od/id/mds2-3867 |
| language |
[ "en" ] |
| license | https://www.nist.gov/open/license |
| modified | 2025-06-25 00:00:00 |
| programCode |
[ "006:045" ] |
| publisher |
{ "name": "National Institute of Standards and Technology", "@type": "org:Organization" } |
| references |
[ "https://doi.org/10.1021/acsanm.5c05142" ] |
| theme |
[ "Electronics:Semiconductors", "Materials:Materials characterization", "Materials:Metals", "Nanotechnology:Nanomechanics", "Nanotechnology:Nanometrology" ] |
| title | Elastic-plastic AFM indentation on copper |
