{
  "@type": "dcat:Dataset",
  "accessLevel": "public",
  "bureauCode": [
    "006:55"
  ],
  "contactPoint": {
    "fn": "Gheorghe Stan",
    "hasEmail": "mailto:gheorghe.stan@nist.gov"
  },
  "description": "Dataset from AFM single-step and multi-step indentations performed on hybrid-bonding copper patterns at room temperature",
  "distribution": [
    {
      "description": "AFM single-step indentation characterization on Cu pads. (a) Characteristic force-displacement curve; (b) Average force-indentation depth curves, with one standard deviation; (c) Histogram fits for plastic metrics: number of pop-ins per indentation curve, plasticity index, cumulative excursion length, and plastic work; (d) Empirical cumulative distribution (ecdf) of maximum shear stress at the first pop-in event.",
      "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/Data_Figure_3.csv",
      "format": "csv",
      "mediaType": "text/csv",
      "title": "Data for Figure 3"
    },
    {
      "description": "AFM single-step indentation comparison of grain boundary (GBdry) and grain interior (GInt) plasticity. (i) Average force-indentation depth curves; (ii) Histogram fits for plastic metrics (number of pop-ins per indentation curve, plasticity index, cumulative excursion length, plastic work); (iii) Empirical cumulative distribution (ecdf) of maximum shear stress at fist pop-in.",
      "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/Data_Figure_4.csv",
      "format": "csv",
      "mediaType": "text/csv",
      "title": "Data for Figure 4"
    },
    {
      "description": "CR-AFM measurements. (i) Indentation moduli over SiO2 and Cu regions as determined from CR-AFM mapping; (ii) Cross-section along the dashed line in (i); (iii) Histogram of the indentation moduli from the map shown in (a).",
      "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/Data_Figure_2.csv",
      "format": "csv",
      "mediaType": "text/csv",
      "title": "Data for Figure 2"
    },
    {
      "description": "Multi-step AFM-indentation experiments. (i) Topographic line scan covering two indents within a Cu pad; (ii) A subset of force-indentation depth curves with the Hertzian fits superimposed on the unloading segments; (iii) Indentation stress-strain curve with stress-strain pairs from all experiments; (iv) Empirical cumulative distribution function of the indentation yield stress from all the experiments; (v) Average force-depth envelope curve for multi-step indentation experiments.",
      "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/Data_Figure_5.csv",
      "format": "csv",
      "mediaType": "text/csv",
      "title": "Data for Figure 5"
    },
    {
      "description": "Representative experimental curves obtained by i) Contact Resonance AFM (CR-AFM), ii) single-step, and iii) multi-step AFM indentation.",
      "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/Data_Figure_1.csv",
      "format": "csv",
      "mediaType": "text/csv",
      "title": "Data for Figure 1"
    },
    {
      "downloadURL": "https://data.nist.gov/od/ds/mds2-3867/3867_README.txt",
      "mediaType": "text/plain",
      "title": "3867_README"
    }
  ],
  "identifier": "ark:/88434/mds2-3867",
  "issued": "2025-08-21",
  "keyword": [
    "AFM",
    "advanced packaging",
    "contact resonance",
    "copper",
    "hybrid bonding",
    "indentation",
    "nanoscale plasticity"
  ],
  "landingPage": "https://data.nist.gov/od/id/mds2-3867",
  "language": [
    "en"
  ],
  "license": "https://www.nist.gov/open/license",
  "modified": "2025-06-25 00:00:00",
  "programCode": [
    "006:045"
  ],
  "publisher": {
    "@type": "org:Organization",
    "name": "National Institute of Standards and Technology"
  },
  "references": [
    "https://doi.org/10.1021/acsanm.5c05142"
  ],
  "theme": [
    "Electronics:Semiconductors",
    "Materials:Materials characterization",
    "Materials:Metals",
    "Nanotechnology:Nanomechanics",
    "Nanotechnology:Nanometrology"
  ],
  "title": "Elastic-plastic AFM indentation on copper"
}