Elastic-plastic Single-Step and Multi-Step Indentation via IIT and AFM on Hybrid Bonding Copper
Resources
7 resources available
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AFM-IIT_Cu_ReadMe
TXT -
ISS
CSV -
IncipientPlasticityECDF
CSV -
IndentationModulusHistogram
CSV -
LineScan
CSV -
PlasticityIndex
CSV -
Spectra
CSV
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Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| accrualPeriodicity | irregular |
| bureauCode |
[ "006:55" ] |
| contactPoint |
{ "fn": "Yvonne Gerbig", "hasEmail": "mailto:yvonne.gerbig@nist.gov" } |
| description | This publication contains the data presented in the associated proceeding paper ”Pushing the Envelope in Mechanical Characterization of Copper in Hybrid-Bonding Patterns for Advanced Packaging: from Instrumented Indentation to Multimodal Atomic Force Microscopy” submitted for publication in the proceedings of the 2026 IEEE 76th Electronic Components and Technology Conference. The datasets were obtained in single-step and multi-step indentations using instrumented indentation (IIT) and atomic force microscope (AFM) on hybrid-bonding copper at room temperature. |
| distribution |
[ { "title": "AFM-IIT_Cu_ReadMe", "mediaType": "text/plain", "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/AFM-IIT_Cu_ReadMe.txt" }, { "title": "ISS", "mediaType": "text/csv", "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/ISS.csv" }, { "title": "IncipientPlasticityECDF", "mediaType": "text/csv", "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/IncipientPlasticityECDF.csv" }, { "title": "IndentationModulusHistogram", "mediaType": "text/csv", "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/IndentationModulusHistogram.csv" }, { "title": "LineScan", "mediaType": "text/csv", "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/LineScan.csv" }, { "title": "PlasticityIndex", "mediaType": "text/csv", "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/PlasticityIndex.csv" }, { "title": "Spectra", "mediaType": "text/csv", "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/Spectra.csv" } ] |
| identifier | ark:/88434/mds2-4076 |
| issued | 2026-03-19 |
| keyword |
[ "AFM", "advanced packaging", "copper", "hybrid bonding", "instrumented indentation", "plasticity", "stress-strain curve", "yield strength" ] |
| landingPage | https://data.nist.gov/od/id/mds2-4076 |
| language |
[ "en" ] |
| license | https://www.nist.gov/open/license |
| modified | 2026-02-02 00:00:00 |
| programCode |
[ "006:045" ] |
| publisher |
{ "name": "National Institute of Standards and Technology", "@type": "org:Organization" } |
| references |
[ "https://doi.org.xxx" ] |
| theme |
[ "Materials:Materials characterization" ] |
| title | Elastic-plastic Single-Step and Multi-Step Indentation via IIT and AFM on Hybrid Bonding Copper |
