{
  "@type": "dcat:Dataset",
  "accessLevel": "public",
  "accrualPeriodicity": "irregular",
  "bureauCode": [
    "006:55"
  ],
  "contactPoint": {
    "fn": "Yvonne Gerbig",
    "hasEmail": "mailto:yvonne.gerbig@nist.gov"
  },
  "description": "This publication contains the data presented in the associated proceeding paper ”Pushing the Envelope in Mechanical Characterization of Copper in Hybrid-Bonding Patterns for Advanced Packaging: from Instrumented Indentation to Multimodal Atomic Force Microscopy” submitted for publication in the proceedings of the 2026 IEEE 76th Electronic Components and Technology Conference. \nThe datasets were obtained in single-step and multi-step indentations using instrumented indentation (IIT) and atomic force microscope (AFM) on hybrid-bonding copper at room temperature.",
  "distribution": [
    {
      "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/AFM-IIT_Cu_ReadMe.txt",
      "mediaType": "text/plain",
      "title": "AFM-IIT_Cu_ReadMe"
    },
    {
      "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/ISS.csv",
      "mediaType": "text/csv",
      "title": "ISS"
    },
    {
      "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/IncipientPlasticityECDF.csv",
      "mediaType": "text/csv",
      "title": "IncipientPlasticityECDF"
    },
    {
      "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/IndentationModulusHistogram.csv",
      "mediaType": "text/csv",
      "title": "IndentationModulusHistogram"
    },
    {
      "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/LineScan.csv",
      "mediaType": "text/csv",
      "title": "LineScan"
    },
    {
      "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/PlasticityIndex.csv",
      "mediaType": "text/csv",
      "title": "PlasticityIndex"
    },
    {
      "downloadURL": "https://data.nist.gov/od/ds/mds2-4076/Spectra.csv",
      "mediaType": "text/csv",
      "title": "Spectra"
    }
  ],
  "identifier": "ark:/88434/mds2-4076",
  "issued": "2026-03-19",
  "keyword": [
    "AFM",
    "advanced packaging",
    "copper",
    "hybrid bonding",
    "instrumented indentation",
    "plasticity",
    "stress-strain curve",
    "yield strength"
  ],
  "landingPage": "https://data.nist.gov/od/id/mds2-4076",
  "language": [
    "en"
  ],
  "license": "https://www.nist.gov/open/license",
  "modified": "2026-02-02 00:00:00",
  "programCode": [
    "006:045"
  ],
  "publisher": {
    "@type": "org:Organization",
    "name": "National Institute of Standards and Technology"
  },
  "references": [
    "https://doi.org.xxx"
  ],
  "theme": [
    "Materials:Materials characterization"
  ],
  "title": "Elastic-plastic Single-Step and Multi-Step Indentation via IIT and AFM on Hybrid Bonding Copper"
}