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Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan

Published by National Institute of Standards and Technology | National Institute of Standards and Technology | Catalog Last Checked: August 02, 2025 at 03:10 PM | Dataset Last Updated: March 01, 2023
The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225

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Complete Metadata
@type dcat:Dataset
accessLevel public
bureauCode 
[
  "006:55"
]
contactPoint 
{
  "fn": "Aaron M. Forster",
  "hasEmail": "mailto:aaron.forster@chips.gov"
}
description The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225
distribution 
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identifier ark:/88434/mds2-2948
issued 2023-03-10
keyword 
[
  "advanced packaging",
  "differential scanning calorimetry",
  "filled polymers",
  "glass transition",
  "heat of reaction",
  "semiconductors",
  "thermal gravimetric analysis",
  "thermosets"
]
landingPage https://data.nist.gov/od/id/mds2-2948
language 
[
  "en"
]
license https://www.nist.gov/open/license
modified 2023-03-01 00:00:00
programCode 
[
  "006:045"
]
publisher 
{
  "name": "National Institute of Standards and Technology",
  "@type": "org:Organization"
}
references 
[
  "https://doi.org/10.1109/ECTC51909.2023.00225"
]
theme 
[
  "Chemistry:Analytical chemistry",
  "Chemistry:Chemical engineering and processing",
  "Chemistry:Thermochemical properties",
  "Materials:Composites",
  "Materials:Materials characterization",
  "Materials:Polymers"
]
title Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan

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