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    • Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan

    Metadata Updated: March 18, 2023

    The data are associated with Figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023.

    Access & Use Information

    Public: This dataset is intended for public access and use. License: See this page for license information.

    Downloads & Resources

    Dates

    Metadata Created Date March 18, 2023
    Metadata Updated Date March 18, 2023
    Data Update Frequency irregular

    Metadata Source

    Harvested from NIST

    Other Data Resources

    Additional Metadata

    Resource Type Dataset
    Metadata Created Date March 18, 2023
    Metadata Updated Date March 18, 2023
    Publisher National Institute of Standards and Technology
    Maintainer
    Identifier ark:/88434/mds2-2948
    Data First Published 2023-03-10
    Language en
    Data Last Modified 2023-03-01 00:00:00
    Category Materials:Materials characterization, Materials:Composites, Materials:Polymers, Chemistry:Chemical engineering and processing, Chemistry:Analytical chemistry, Chemistry:Thermochemical properties
    Public Access Level public
    Data Update Frequency irregular
    Bureau Code 006:55
    Metadata Context https://project-open-data.cio.gov/v1.1/schema/data.json
    Schema Version https://project-open-data.cio.gov/v1.1/schema
    Catalog Describedby https://project-open-data.cio.gov/v1.1/schema/catalog.json
    Harvest Object Id bd8dbac1-f3ff-4c0a-902d-23971f8d1e21
    Harvest Source Id 74e175d9-66b3-4323-ac98-e2a90eeb93c0
    Harvest Source Title NIST
    Homepage URL https://data.nist.gov/od/id/mds2-2948
    License https://www.nist.gov/open/license
    Program Code 006:045
    Source Datajson Identifier True
    Source Hash 2a5733008f4494a4252d686d671a5de68d451b62
    Source Schema Version 1.1

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