{"@type": "dcat:Dataset", "accessLevel": "public", "bureauCode": ["006:55"], "contactPoint": {"fn": "Aaron M. Forster", "hasEmail": "mailto:aaron.forster@chips.gov"}, "description": "The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225", "distribution": [{"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%201%20ECTC.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%201%20ECTC.xlsx.sha256", "mediaType": "text/plain"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%202%20ECTC.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%202%20ECTC.xlsx.sha256", "mediaType": "text/plain"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%203%20ECTC.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%203%20ECTC.xlsx.sha256", "mediaType": "text/plain"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%204%20ECTC.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%204%20ECTC.xlsx.sha256", "mediaType": "text/plain"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%205%20ECTC.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%205%20ECTC.xlsx.sha256", "mediaType": "text/plain"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%206%20ECTC.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%206%20ECTC.xlsx.sha256", "mediaType": "text/plain"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%207%20ECTC.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%207%20ECTC.xlsx.sha256", "mediaType": "text/plain"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%208%20ECTC.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet"}, {"downloadURL": "https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%208%20ECTC.xlsx.sha256", "mediaType": "text/plain"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-2948/2948_README.txt", "mediaType": "text/plain", "title": "README"}], "identifier": "ark:/88434/mds2-2948", "issued": "2023-03-10", "keyword": ["advanced packaging", "differential scanning calorimetry", "filled polymers", "glass transition", "heat of reaction", "semiconductors", "thermal gravimetric analysis", "thermosets"], "landingPage": "https://data.nist.gov/od/id/mds2-2948", "language": ["en"], "license": "https://www.nist.gov/open/license", "modified": "2023-03-01 00:00:00", "programCode": ["006:045"], "publisher": {"@type": "org:Organization", "name": "National Institute of Standards and Technology"}, "references": ["https://doi.org/10.1109/ECTC51909.2023.00225"], "theme": ["Chemistry:Analytical chemistry", "Chemistry:Chemical engineering and processing", "Chemistry:Thermochemical properties", "Materials:Composites", "Materials:Materials characterization", "Materials:Polymers"], "title": "Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan"}