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#1 Federal
Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan
- Organization: National Institute of Standards and Technology
- Dataset Last Updated: March 01, 2023
The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked...
- XLSX
- TXT
- XLSX
- TXT
- XLSX
- TXT
- +11 more
Search relevance: 1.00 | Views last month: 2 | Catalog Last Checked: September 10, 2026 at 05:52 PM
#2 Federal
Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan
- Organization: Department of Commerce
- Dataset Last Updated: March 01, 2023
The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked...
- XLSX
- TXT
- XLSX
- TXT
- XLSX
- TXT
- +11 more
Search relevance: 1.00 | Views last month: 0 | Catalog Last Checked: October 02, 2026 at 07:53 PM

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