-
Federal
Data associated with "Characterizing the broadband RF permittivity of 3D-integrated layers in a glass wafer stack from 100 MHz to 30 GHz" for the 2024 International Microwave Symposium (IMS) in Washington, D.C.
National Institute of Standards and Technology —
We present a method for accurately determining the permittivity of dielectric materials in 3D integrated structures at broadband RF frequencies. With applications of... -
Federal
Calibration Data for Wafer 2 of SRM 3461 - MEMS Cantilever Stiffness
National Institute of Standards and Technology —
SRM 3461 is an AFM sized chip with an array of seven cantilevers on each chip. The uniformity of the chips offered for sale from wafer 2 is excellent and the SRM... -
Federal
ProSAS: An O-RAN Approach to Spectrum Sharing between NR and LTE
National Institute of Standards and Technology —
The dataset corresponds to the findings detailed in the paper titled "ProSAS: An O-RAN Approach to Spectrum Sharing between NR and LTE," to be included in the... -
Federal
Calibration Data for Wafer 2 of SRM 3461 - MEMS Cantilever Stiffness
Department of Commerce —
SRM 3461 is an AFM sized chip with an array of seven cantilevers on each chip. The uniformity of the chips offered for sale from wafer 2 is excellent and the SRM... -
Federal
Physical Models and Dimensional Traceability of 2.4 mm Coaxial Airline Standards for Determining Systematic Uncertainties of Calibrated Scattering-Parameters
Department of Commerce —
Physical Models and Dimensional Traceability of 2.4 mm Coaxial Airline Standards for Determining Systematic Uncertainties of Calibrated Scattering-Parameters