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    • Data associated with "Characterizing the broadband RF permittivity of 3D-integrated layers in a glass wafer stack from 100 MHz to 30 GHz" for the 2024 International Microwave Symposium (IMS) in Washington, D.C.

    Metadata Updated: February 1, 2024

    We present a method for accurately determining the permittivity of dielectric materials in 3D integrated structures at broadband RF frequencies. With applications of microwave and millimeter-wave electronics on the rise, reliable methods for measuring the electrical properties of dielectrics used in integrated circuits are critical. We outline an on-wafer method for extracting the permittivity of a 3D multilayer glass structure from 100 MHz to 30 GHz using S-parameter measurements of different calibration chips. Our method can be used to inform better design of metrology for dielectric materials for 3D integrated circuit technologies.This is data associated with the manuscript "Characterizing the broadband RF permittivity of 3D-integrated layers in a glass wafer stack from 100 MHz to 30 GHz" for the 2024 International Microwave Symposium (IMS) in Washington, D.C. The manuscript is currently under review by ERB in the NPS system under PUB ID 957051 / N2024-0193

    Access & Use Information

    Public: This dataset is intended for public access and use. License: See this page for license information.

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    Dates

    Metadata Created Date February 1, 2024
    Metadata Updated Date February 1, 2024
    Data Update Frequency irregular

    Metadata Source

    Harvested from NIST

    Other Data Resources

    Additional Metadata

    Resource Type Dataset
    Metadata Created Date February 1, 2024
    Metadata Updated Date February 1, 2024
    Publisher National Institute of Standards and Technology
    Maintainer
    Identifier ark:/88434/mds2-3111
    Data First Published 2024-01-09
    Language en
    Data Last Modified 2023-11-17 00:00:00
    Category Metrology:Electrical/electromagnetic metrology, Metrology:Dimensional metrology, Materials:Concrete/cement, Materials:Materials characterization, Advanced Communications:Wireless (RF), Electronics:Thin-film electronics, Electronics:Electromagnetics
    Public Access Level public
    Data Update Frequency irregular
    Bureau Code 006:55
    Metadata Context https://project-open-data.cio.gov/v1.1/schema/data.json
    Schema Version https://project-open-data.cio.gov/v1.1/schema
    Catalog Describedby https://project-open-data.cio.gov/v1.1/schema/catalog.json
    Harvest Object Id 7e0b5e24-6fb1-462a-8675-87302d44fe39
    Harvest Source Id 74e175d9-66b3-4323-ac98-e2a90eeb93c0
    Harvest Source Title NIST
    Homepage URL https://data.nist.gov/od/id/mds2-3111
    License https://www.nist.gov/open/license
    Program Code 006:045
    Source Datajson Identifier True
    Source Hash 2ef3a35d753b235aaaa1f47e2530dbfc43f284a15db6839b6bb55606d6c3e7df
    Source Schema Version 1.1

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