Data associated with "Characterizing the broadband RF permittivity of 3D-integrated layers in a glass wafer stack from 100 MHz to 30 GHz" for the 2024 International Microwave Symposium (IMS) in Washington, D.C. - Figure 4c_Resistance-Inductance-Capacitance of Chip 3 superstrate calibration chip

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Name	Figure 4c_Resistance-Inductance-Capacitance of Chip 3 superstrate calibration chip
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Figure 4c_Resistance-Inductance-Capacitance of...

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