Text File
URL: https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%206%20ECTC.xlsx.sha256
From the dataset abstract
The data are associated with Figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An...
Source: Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan
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