Patent AT-E400895-T1: [Translated] LOW TEMPERATURE RADIATION IMAGING APPARATUS WITH CUPS BONDING
An x-ray and gamma-ray radiant energy imaging device is disclosed having a temperature sensitive semiconductor detector substrate bump-bonded to a semiconductor CMOS readout substrate. The temperature sensitive, semiconductor detector substrate utilizes Tellurium compound materials, such as CdTe and CdZnTe. The bump bonds are formed of a low-temperature, lead-free binary solder alloy having a melting point between about 100° C. and about 180° C. Also described is a process for forming solder bumps utilizing the low-temperature, lead-free binary solder alloy, to prevent damage to temperature sensitive and potentially brittle detector substrate when assembling the imaging device.
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Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| bureauCode |
[
"009:25"
]
|
| contactPoint |
{
"fn": "NIH/NCBI Data Team",
"@type": "vcard:Contact",
"hasEmail": "mailto:info@ncbi.nlm.nih.gov"
}
|
| description | An x-ray and gamma-ray radiant energy imaging device is disclosed having a temperature sensitive semiconductor detector substrate bump-bonded to a semiconductor CMOS readout substrate. The temperature sensitive, semiconductor detector substrate utilizes Tellurium compound materials, such as CdTe and CdZnTe. The bump bonds are formed of a low-temperature, lead-free binary solder alloy having a melting point between about 100° C. and about 180° C. Also described is a process for forming solder bumps utilizing the low-temperature, lead-free binary solder alloy, to prevent damage to temperature sensitive and potentially brittle detector substrate when assembling the imaging device. |
| distribution |
[
{
"@type": "dcat:Distribution",
"title": "Official Data Source",
"mediaType": "text/html",
"description": "Access the complete Patent AT-E400895-T1: [Translated] LOW TEMPERATURE RADIATION IMAGING APPARATUS WITH CUPS BONDING on the official website.",
"downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E400895-T1"
}
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|
| identifier | https://healthdata.gov/api/views/g8kd-tf6p |
| issued | 2025-09-05 |
| keyword |
[
"chemistry",
"innovation",
"patent",
"pubchem",
"research"
]
|
| landingPage | https://healthdata.gov/d/g8kd-tf6p |
| modified | 2025-09-06 |
| programCode |
[
"009:066"
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|
| publisher |
{
"name": "National Center for Biotechnology Information (NCBI)",
"@type": "org:Organization"
}
|
| theme |
[
"NIH"
]
|
| title | Patent AT-E400895-T1: [Translated] LOW TEMPERATURE RADIATION IMAGING APPARATUS WITH CUPS BONDING |
