{"@type": "dcat:Dataset", "accessLevel": "public", "bureauCode": ["009:25"], "contactPoint": {"@type": "vcard:Contact", "fn": "NIH/NCBI Data Team", "hasEmail": "mailto:info@ncbi.nlm.nih.gov"}, "description": "An x-ray and gamma-ray radiant energy imaging device is disclosed having a temperature sensitive semiconductor detector substrate bump-bonded to a semiconductor CMOS readout substrate. The temperature sensitive, semiconductor detector substrate utilizes Tellurium compound materials, such as CdTe and CdZnTe. The bump bonds are formed of a low-temperature, lead-free binary solder alloy having a melting point between about 100\u00b0 C. and about 180\u00b0 C. Also described is a process for forming solder bumps utilizing the low-temperature, lead-free binary solder alloy, to prevent damage to temperature sensitive and potentially brittle detector substrate when assembling the imaging device.", "distribution": [{"@type": "dcat:Distribution", "description": "Access the complete Patent AT-E400895-T1: [Translated] LOW TEMPERATURE RADIATION IMAGING APPARATUS WITH CUPS BONDING on the official website.", "downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E400895-T1", "mediaType": "text/html", "title": "Official Data Source"}], "identifier": "https://healthdata.gov/api/views/g8kd-tf6p", "issued": "2025-09-05", "keyword": ["chemistry", "innovation", "patent", "pubchem", "research"], "landingPage": "https://healthdata.gov/d/g8kd-tf6p", "modified": "2025-09-06", "programCode": ["009:066"], "publisher": {"@type": "org:Organization", "name": "National Center for Biotechnology Information (NCBI)"}, "theme": ["NIH"], "title": "Patent AT-E400895-T1: [Translated] LOW TEMPERATURE RADIATION IMAGING APPARATUS WITH CUPS BONDING"}