Patent AT-E400894-T1: [Translated] COOLED ELECTRONIC ARRANGEMENT AND METHOD FOR COOLING A CIRCUIT BOARD
A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board.
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Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| bureauCode |
[ "009:25" ] |
| contactPoint |
{ "fn": "NIH/NCBI Data Team", "@type": "vcard:Contact", "hasEmail": "mailto:info@ncbi.nlm.nih.gov" } |
| description | A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board. |
| distribution |
[ { "@type": "dcat:Distribution", "title": "Official Data Source", "mediaType": "text/html", "description": "Access the complete Patent AT-E400894-T1: [Translated] COOLED ELECTRONIC ARRANGEMENT AND METHOD FOR COOLING A CIRCUIT BOARD on the official website.", "downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E400894-T1" } ] |
| identifier | https://healthdata.gov/api/views/iwi2-6cek |
| issued | 2025-09-05 |
| keyword |
[ "chemistry", "innovation", "patent", "pubchem", "research" ] |
| landingPage | https://healthdata.gov/d/iwi2-6cek |
| modified | 2025-09-06 |
| programCode |
[ "009:066" ] |
| publisher |
{ "name": "National Center for Biotechnology Information (NCBI)", "@type": "org:Organization" } |
| theme |
[ "NIH" ] |
| title | Patent AT-E400894-T1: [Translated] COOLED ELECTRONIC ARRANGEMENT AND METHOD FOR COOLING A CIRCUIT BOARD |
