{
  "@type": "dcat:Dataset",
  "accessLevel": "public",
  "bureauCode": [
    "009:25"
  ],
  "contactPoint": {
    "@type": "vcard:Contact",
    "fn": "NIH/NCBI Data Team",
    "hasEmail": "mailto:info@ncbi.nlm.nih.gov"
  },
  "description": "A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board.",
  "distribution": [
    {
      "@type": "dcat:Distribution",
      "description": "Access the complete Patent AT-E400894-T1: [Translated] COOLED ELECTRONIC ARRANGEMENT AND METHOD FOR COOLING A CIRCUIT BOARD on the official website.",
      "downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E400894-T1",
      "mediaType": "text/html",
      "title": "Official Data Source"
    }
  ],
  "identifier": "https://healthdata.gov/api/views/iwi2-6cek",
  "issued": "2025-09-05",
  "keyword": [
    "chemistry",
    "innovation",
    "patent",
    "pubchem",
    "research"
  ],
  "landingPage": "https://healthdata.gov/d/iwi2-6cek",
  "modified": "2025-09-06",
  "programCode": [
    "009:066"
  ],
  "publisher": {
    "@type": "org:Organization",
    "name": "National Center for Biotechnology Information (NCBI)"
  },
  "theme": [
    "NIH"
  ],
  "title": "Patent AT-E400894-T1: [Translated] COOLED ELECTRONIC ARRANGEMENT AND METHOD FOR COOLING A CIRCUIT BOARD"
}