Patent AT-E400395-T1: [Translated] SOLDER PASTES
A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5 - 10.0 wt% of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01 - 10.0 wt% of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.
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Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| bureauCode |
[ "009:25" ] |
| contactPoint |
{ "fn": "NIH/NCBI Data Team", "@type": "vcard:Contact", "hasEmail": "mailto:info@ncbi.nlm.nih.gov" } |
| description | A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5 - 10.0 wt% of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01 - 10.0 wt% of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability. |
| distribution |
[ { "@type": "dcat:Distribution", "title": "Official Data Source", "mediaType": "text/html", "description": "Access the complete Patent AT-E400395-T1: [Translated] SOLDER PASTES on the official website.", "downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E400395-T1" } ] |
| identifier | https://healthdata.gov/api/views/t2aq-9stu |
| issued | 2025-09-05 |
| keyword |
[ "chemistry", "innovation", "patent", "pubchem", "research" ] |
| landingPage | https://healthdata.gov/d/t2aq-9stu |
| modified | 2025-09-06 |
| programCode |
[ "009:066" ] |
| publisher |
{ "name": "National Center for Biotechnology Information (NCBI)", "@type": "org:Organization" } |
| theme |
[ "NIH" ] |
| title | Patent AT-E400395-T1: [Translated] SOLDER PASTES |
