{
  "@type": "dcat:Dataset",
  "accessLevel": "public",
  "bureauCode": [
    "009:25"
  ],
  "contactPoint": {
    "@type": "vcard:Contact",
    "fn": "NIH/NCBI Data Team",
    "hasEmail": "mailto:info@ncbi.nlm.nih.gov"
  },
  "description": "A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5 - 10.0 wt% of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01 - 10.0 wt% of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.",
  "distribution": [
    {
      "@type": "dcat:Distribution",
      "description": "Access the complete Patent AT-E400395-T1: [Translated] SOLDER PASTES on the official website.",
      "downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E400395-T1",
      "mediaType": "text/html",
      "title": "Official Data Source"
    }
  ],
  "identifier": "https://healthdata.gov/api/views/t2aq-9stu",
  "issued": "2025-09-05",
  "keyword": [
    "chemistry",
    "innovation",
    "patent",
    "pubchem",
    "research"
  ],
  "landingPage": "https://healthdata.gov/d/t2aq-9stu",
  "modified": "2025-09-06",
  "programCode": [
    "009:066"
  ],
  "publisher": {
    "@type": "org:Organization",
    "name": "National Center for Biotechnology Information (NCBI)"
  },
  "theme": [
    "NIH"
  ],
  "title": "Patent AT-E400395-T1: [Translated] SOLDER PASTES"
}