Skip to main content
U.S. flag

An official website of the United States government

Return to search results

Data for Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging

Published by National Institute of Standards and Technology | National Institute of Standards and Technology | Catalog Last Checked: September 02, 2026 at 07:19 PM | Dataset Last Updated: July 24, 2026
The data are associated with figures in R. Giang, R. Tao,*, E. Moukhina, A. L. Forster, T. J. Cho, P. Centellas, S. Romberg, Z. Tsinas, C. Soles, Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging, Journal of Polymer Science 2026, https://doi.org/10.1002/pola.70283

Resources

8 resources available

Find Related Datasets

data.gov

An official website of the GSA's Technology Transformation Services

Looking for U.S. government information and services?
Visit USA.gov