{"@type": "dcat:Dataset", "accessLevel": "public", "bureauCode": ["006:55"], "contactPoint": {"fn": "Ran Tao", "hasEmail": "mailto:ran.tao@nist.gov"}, "description": "The data are associated with figures in R. Giang, R. Tao,*, E. Moukhina, A. L. Forster, T. J. Cho, P. Centellas, S. Romberg, Z. Tsinas, C. Soles, Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging, Journal of Polymer Science 2026, https://doi.org/10.1002/pola.70283", "distribution": [{"downloadURL": "https://data.nist.gov/od/ds/mds2-4162/4162_README.txt", "mediaType": "text/plain", "title": "README file"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-4162/Figure%201%20data.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet", "title": "Figure 1 data"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-4162/Figure%202%20data.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet", "title": "Figure 2 data"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-4162/Figure%203%20data.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet", "title": "Figure 3 data"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-4162/Figure%204%20data.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet", "title": "Figure 4 data"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-4162/Figure%205%20data.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet", "title": "Figure 5 data"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-4162/Figure%206%20data.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet", "title": "Figure 6 data"}, {"downloadURL": "https://data.nist.gov/od/ds/mds2-4162/Figure%207%20data.xlsx", "mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet", "title": "Figure 7 data"}], "identifier": "ark:/88434/mds2-4162", "issued": "2026-07-27", "keyword": ["advanced electronic packaging", "cure kinetics", "differential scanning calorimetry", "diffusion-controlled\nreaction", "epoxy underfill", "isoconversional analysis", "thermal endurance", "thermogravimetric analysis", "vitrification"], "language": ["en"], "license": "https://www.nist.gov/open/license", "modified": "2026-07-24 00:00:00", "programCode": ["006:045"], "publisher": {"@type": "org:Organization", "name": "National Institute of Standards and Technology"}, "references": ["https://doi.org/10.1002/pola.70283"], "theme": ["Materials:Composites", "Materials:Materials characterization", "Materials:Polymers"], "title": "Data for Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging"}