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    • Data for "Distributed contactless interconnects for millimeter-wave heterogeneous integration"

    Metadata Updated: September 30, 2025

    Included here are figures and other relevant data from the paper "Distributed contactless interconnects for millimeter-wave heterogeneous integration", submitted to TMTT Letters. Abstract: State-of-the-art integrated circuits leverage dissimilar materials to optimize system performance. Such heterogeneous integration often involves multiple chips electrically coupled to one another via bump bonds or wire-bond interconnects. While these interconnects are a mature technology for low-frequency operation (< 100 GHz), they have stringent fabrication requirements and are prone to failure during operation in the terahertz range (300 GHz to 10 THz). Next-generation integrated circuits require alternative interconnect topologies that are less sensitive to fabrication tolerances and conditions, are more robust, and have superior high-frequency performance. Here, we demonstrate distributed coupling to 325 GHz between broadside-coupled coplanar waveguides without bump bonds, wire bonds, or direct metal-to-metal bonding. The insertion loss of these contactless interconnects was approximately 1.4 dB at the maximum in the passbands at 63 GHz, 93 GHz, and 120 GHz. This interconnect topology enables robust integration of low-cost silicon with high-speed compound semiconductors for terahertz communications networks to improve reliability and increase yield.

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    Public: This dataset is intended for public access and use. License: See this page for license information.

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    Dates

    Metadata Created Date September 30, 2025
    Metadata Updated Date September 30, 2025
    Data Update Frequency irregular

    Metadata Source

    Harvested from Commerce Non Spatial Data.json Harvest Source

    Other Data Resources

    Additional Metadata

    Resource Type Dataset
    Metadata Created Date September 30, 2025
    Metadata Updated Date September 30, 2025
    Publisher National Institute of Standards and Technology
    Maintainer
    Identifier ark:/88434/mds2-2777
    Data First Published 2023-02-09
    Language en
    Data Last Modified 2022-12-15 00:00:00
    Category Electronics:Electromagnetics, Metrology:Electrical/electromagnetic metrology
    Public Access Level public
    Data Update Frequency irregular
    Bureau Code 006:55
    Metadata Context https://project-open-data.cio.gov/v1.1/schema/catalog.jsonld
    Schema Version https://project-open-data.cio.gov/v1.1/schema
    Catalog Describedby https://project-open-data.cio.gov/v1.1/schema/catalog.json
    Harvest Object Id 2da439a8-6877-47c2-b20f-09b46ab45b2a
    Harvest Source Id bce99b55-29c1-47be-b214-b8e71e9180b1
    Harvest Source Title Commerce Non Spatial Data.json Harvest Source
    Homepage URL https://data.nist.gov/od/id/mds2-2777
    License https://www.nist.gov/open/license
    Program Code 006:045
    Source Datajson Identifier True
    Source Hash d4ac47b93ae6987cb798ddfabac8fd2f75cc28d4916cb1ce68d68fdbb8183e2b
    Source Schema Version 1.1

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