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    • Data for "Distributed contactless interconnects for millimeter-wave heterogeneous integration"

    Metadata Updated: February 23, 2023

    Included here are figures and other relevant data from the paper "Distributed contactless interconnects for millimeter-wave heterogeneous integration", submitted to TMTT Letters. Abstract: State-of-the-art integrated circuits leverage dissimilar materials to optimize system performance. Such heterogeneous integration often involves multiple chips electrically coupled to one another via bump bonds or wire-bond interconnects. While these interconnects are a mature technology for low-frequency operation (< 100 GHz), they have stringent fabrication requirements and are prone to failure during operation in the terahertz range (300 GHz to 10 THz). Next-generation integrated circuits require alternative interconnect topologies that are less sensitive to fabrication tolerances and conditions, are more robust, and have superior high-frequency performance. Here, we demonstrate distributed coupling to 325 GHz between broadside-coupled coplanar waveguides without bump bonds, wire bonds, or direct metal-to-metal bonding. The insertion loss of these contactless interconnects was approximately 1.4 dB at the maximum in the passbands at 63 GHz, 93 GHz, and 120 GHz. This interconnect topology enables robust integration of low-cost silicon with high-speed compound semiconductors for terahertz communications networks to improve reliability and increase yield.

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    Public: This dataset is intended for public access and use. License: See this page for license information.

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    Dates

    Metadata Created Date February 23, 2023
    Metadata Updated Date February 23, 2023
    Data Update Frequency irregular

    Metadata Source

    Harvested from NIST

    Other Data Resources

    Additional Metadata

    Resource Type Dataset
    Metadata Created Date February 23, 2023
    Metadata Updated Date February 23, 2023
    Publisher National Institute of Standards and Technology
    Maintainer
    Identifier ark:/88434/mds2-2777
    Data First Published 2023-02-09
    Language en
    Data Last Modified 2022-12-15 00:00:00
    Category Electronics:Electromagnetics, Metrology:Electrical/electromagnetic metrology
    Public Access Level public
    Data Update Frequency irregular
    Bureau Code 006:55
    Metadata Context https://project-open-data.cio.gov/v1.1/schema/data.json
    Schema Version https://project-open-data.cio.gov/v1.1/schema
    Catalog Describedby https://project-open-data.cio.gov/v1.1/schema/catalog.json
    Harvest Object Id 324259c0-1867-4efe-984b-ce31a35a4e3e
    Harvest Source Id 74e175d9-66b3-4323-ac98-e2a90eeb93c0
    Harvest Source Title NIST
    Homepage URL https://data.nist.gov/od/id/mds2-2777
    License https://www.nist.gov/open/license
    Program Code 006:045
    Source Datajson Identifier True
    Source Hash 26e11347a495d669860da03fa53af0a231c78439
    Source Schema Version 1.1

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