Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins for material extrusion
Thermoset composite structures printed at room temperature using direct ink writing often collapse during thermal post-curing. This behavior suggests that the rheological properties that govern structural stability (i.e., storage modulus and/or yield stress) are sensitive to both temperature and conversion. The rheo-Raman instrument provides a way to directly link rheological properties, temperature, and conversion. Using this technique, we characterized how the yield stress and storage modulus evolve as a function of conversion at different temperatures and filler contents of fumed silica. This data set focuses on a diglycidyl ether of bisphenol A (DGEBA) epoxy resin (Epon 826, Hexion, Ohio, USA) cured with Jeffamine D-230 (Huntsman Corporation, Texas, USA). Three resins with fumed silica (Cabot Corporation, Massachusetts, USA) mass fractions of 0 %, 5 %, and 10 % were cured and observed isothermally at 70 °C and 100 °C. Rheological and Raman data were obtained, analyzed, and then combined to determine how the yield stress and storage modulus evolve with conversion at different temperatures. These results motivated a two-step schedule designed to prevent a reduction in rheological properties during curing while quickly driving the reaction to high conversion. The two-step schedule began at 70 °C then ramped to 100 °C and is also included in this dataset. This data is described in: Romberg, S.K., & Kotula, A.P. (2023) Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins, National Institute of Standards and Technology, submitted for publication.
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Dataset - Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composites for material extrusion
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Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| accrualPeriodicity | irregular |
| bureauCode |
[ "006:55" ] |
| contactPoint |
{ "fn": "Stian Romberg", "hasEmail": "mailto:stian.romberg@nist.gov" } |
| description | Thermoset composite structures printed at room temperature using direct ink writing often collapse during thermal post-curing. This behavior suggests that the rheological properties that govern structural stability (i.e., storage modulus and/or yield stress) are sensitive to both temperature and conversion. The rheo-Raman instrument provides a way to directly link rheological properties, temperature, and conversion. Using this technique, we characterized how the yield stress and storage modulus evolve as a function of conversion at different temperatures and filler contents of fumed silica. This data set focuses on a diglycidyl ether of bisphenol A (DGEBA) epoxy resin (Epon 826, Hexion, Ohio, USA) cured with Jeffamine D-230 (Huntsman Corporation, Texas, USA). Three resins with fumed silica (Cabot Corporation, Massachusetts, USA) mass fractions of 0 %, 5 %, and 10 % were cured and observed isothermally at 70 °C and 100 °C. Rheological and Raman data were obtained, analyzed, and then combined to determine how the yield stress and storage modulus evolve with conversion at different temperatures. These results motivated a two-step schedule designed to prevent a reduction in rheological properties during curing while quickly driving the reaction to high conversion. The two-step schedule began at 70 °C then ramped to 100 °C and is also included in this dataset. This data is described in: Romberg, S.K., & Kotula, A.P. (2023) Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins, National Institute of Standards and Technology, submitted for publication. |
| distribution |
[ { "title": "README", "format": "text", "mediaType": "text/plain", "description": "This text file describes the files in the dataset.", "downloadURL": "https://data.nist.gov/od/ds/mds2-2918/README.txt" }, { "title": "Dataset - Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composites for material extrusion", "format": "zip", "mediaType": "application/x-zip-compressed", "description": "This zip file includes all of the data described in the README file.", "downloadURL": "https://data.nist.gov/od/ds/mds2-2918/ALL%20DATA.zip" } ] |
| identifier | ark:/88434/mds2-2918 |
| issued | 2023-03-07 |
| keyword |
[ "cure kinetics", "direct ink writing", "rheo-Raman", "thermal post-cure", "thermoset composite", "yield stress fluid" ] |
| landingPage | https://data.nist.gov/od/id/mds2-2918 |
| language |
[ "en" ] |
| license | https://www.nist.gov/open/license |
| modified | 2023-01-30 00:00:00 |
| programCode |
[ "006:045" ] |
| publisher |
{ "name": "National Institute of Standards and Technology", "@type": "org:Organization" } |
| theme |
[ "Manufacturing", "Manufacturing:Additive manufacturing", "Materials", "Materials:Composites", "Materials:Polymers", "Metrology:Flow metrology and rheology", "Physics:Spectroscopy" ] |
| title | Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins for material extrusion |
