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Prognostics Approach For Power Mosfet Under Thermal-Stress Aging

Metadata Updated: December 6, 2023

The prognostic technique for a power MOSFET presented in this paper is based on accelerated aging of MOSFET IRF520Npbf in a TO-220 package. The methodology utilizes thermal and power cycling to accelerate the life of the devices. The major failure mechanism for the stress conditions is die attachment degradation, typical for discrete devices with lead free solder die attachment. It has been determined that die attach degradation results in an increase in ON-state resistance due to its dependence on junction temperature. Increasing resistance, thus, can be used as a precursor of failure for the die-attach failure mechanism under thermal stress. A feature based on normalized ON-resistance is computed from in-situ measurements of the electro-thermal response. An Extended Kalman filter is used as a model-based prognostics techniques based on the Bayesian tracking framework.

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Public: This dataset is intended for public access and use. License: No license information was provided. If this work was prepared by an officer or employee of the United States government as part of that person's official duties it is considered a U.S. Government Work.

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Metadata Created Date November 12, 2020
Metadata Updated Date December 6, 2023
Data Update Frequency irregular

Metadata Source

Harvested from NASA Data.json

Additional Metadata

Resource Type Dataset
Metadata Created Date November 12, 2020
Metadata Updated Date December 6, 2023
Publisher Dashlink
Identifier DASHLINK_857
Data First Published 2013-12-12
Data Last Modified 2020-01-29
Public Access Level public
Data Update Frequency irregular
Bureau Code 026:00
Metadata Context
Metadata Catalog ID
Schema Version
Catalog Describedby
Harvest Object Id 62ef3bb1-3763-4dbd-968b-afde9f37dee4
Harvest Source Id 58f92550-7a01-4f00-b1b2-8dc953bd598f
Harvest Source Title NASA Data.json
Homepage URL
Program Code 026:029
Source Datajson Identifier True
Source Hash 40becd3b1ad51f26cec6633457cb8203a3bb21cab03e86b60d9d7e51a970f7da
Source Schema Version 1.1

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