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Patent AT-E400405-T1: [Translated] METHOD FOR PRODUCING A GRINDING ARTICLE

Published by National Center for Biotechnology Information (NCBI) | U.S. Department of Health & Human Services | Catalog Last Checked: July 31, 2026 at 09:07 PM | Dataset Last Updated: September 06, 2025
A method of making an abrasive article for wafer planarization, the method comprising providing an abrasive coating composition, providing a backing having a first major surface, said surface having a first portion and a second portion, and bringing the backing into contact with the abrasive coating composition, so that the abrasive coating composition substantially adheres only to the first portion of the backing.

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