Data for A Dual Mode Brillouin/Low-Frequency Raman Spectroscopy Microscope for Local Mechanical Property Imaging for Semiconductor Packaging Materials

Published by National Institute of Standards and Technology | National Institute of Standards and Technology | Catalog Last Checked: September 10, 2026 at 05:53 PM | Dataset Last Updated: February 27, 2025

This dataset contains Brillouin light scattering (BLS) and low-frequency Raman (LFR) spectroscopy measurements as collected using a custom-built microscope and spectrometer platform. The platform is used to investigate the mechanical properties of semiconductor packaging materials. This dual-mode microscope is capable of both in situ temporal and hyperspectral imaging acquisition modes. The in situ temporal mode is used to monitor the cure of an epoxy sample as well as post-cure temperature cycling to probe the mechanical properties and glass transition temperature of polymers. The hyperspectral imaging mode is used to analyze a multicomponent sample which is representative of a material with multiple degrees of cure. The primary material which is investigated is a bisphenol A diglycidyl ether (DGEBA)-based epoxy cured with various curing agents. This dataset accompanies a publication (S. Engmann et al. 2025 IEEE ECTC, doi: 10.1109/ECTC51687.2025.00288) which contains figures displaying this data.

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description	This dataset contains Brillouin light scattering (BLS) and low-frequency Raman (LFR) spectroscopy measurements as collected using a custom-built microscope and spectrometer platform. The platform is used to investigate the mechanical properties of semiconductor packaging materials. This dual-mode microscope is capable of both in situ temporal and hyperspectral imaging acquisition modes. The in situ temporal mode is used to monitor the cure of an epoxy sample as well as post-cure temperature cycling to probe the mechanical properties and glass transition temperature of polymers. The hyperspectral imaging mode is used to analyze a multicomponent sample which is representative of a material with multiple degrees of cure. The primary material which is investigated is a bisphenol A diglycidyl ether (DGEBA)-based epoxy cured with various curing agents. This dataset accompanies a publication (S. Engmann et al. 2025 IEEE ECTC, doi: 10.1109/ECTC51687.2025.00288) which contains figures displaying this data.
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identifier	ark:/88434/mds2-3725
issued	2025-04-25
keyword	[ "Brillouin light scattering spectroscopy", "in situ", "kinetics", "low-frequency Raman spectroscopy", "mechanical properties", "microscopy", "packaging polymers" ]
landingPage	https://data.nist.gov/od/id/mds2-3725
language	[ "en" ]
license	https://www.nist.gov/open/license
modified	2025-02-27 00:00:00
programCode	[ "006:045" ]
publisher	{ "name": "National Institute of Standards and Technology", "@type": "org:Organization" }
theme	[ "Materials:Polymers", "Metrology:Optical, photometry, and laser metrology", "Physics:Spectroscopy" ]
title	Data for A Dual Mode Brillouin/Low-Frequency Raman Spectroscopy Microscope for Local Mechanical Property Imaging for Semiconductor Packaging Materials

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