Figure 1: Reference chip, air and composite...
URL: https://data.nist.gov/od/ds/mds2-2911/Figure%201.png
PDMS composites with 30% and 60% (weight ratio) barium hexaferrite were directly placed on test chips with CPWs for flip chip measurements. The Reference die is used for on-wafer calibration with necessary devices to perform multiline through-reflect-line (mTRL) and series resistor calibration [Orloff2011]. Test chip has 8 identical transmission lines of 11 mm. Schematic diagrams of the top-view and cross section of the composite (superstrate) loaded transmission line are shown on the bottom and right-hand of the image.
Source: Broadband Electromagnetic Properties of Engineered Flexible Absorber Materials
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| Name | Figure 1: Reference chip, air and composite loaded test chips subject to measurement. |
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| Created | 2 months ago |
| Media type | image/png |
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| id | 08f532f8-54dd-4ce4-87f2-e3f042ab128e |
| metadata modified | 2 months ago |
| package id | 033f3f74-514b-4373-986b-360a9438341f |
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