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Federal
Data and scripts associated with "Quantification of STEM-in-SEM Energy Dispersive X-ray Spectra using Bulk Standards"
Department of Commerce —
Spectra measured from SRM-2063a and standards at 20 keV, 25 keV and 30 keV. Scripts for processing this data. Scripts for Monte Carlo simulating thin films of... -
Federal
Electric field inhomogeneity
Department of Commerce —
Measurement of the effect of electric field inhomogeneity on electromagnetically induced transparency in a waveguide-based cesium atomic vapor cell. Used for the... -
Federal
Parametric simulations of microwave microfluidic measurement sensitivity to dielectric changes in polymer-fluid interfaces
Department of Commerce —
This data set contains data used to generate plots in the paper "Microwave Characterization of Parylene C Dielectric and Barrier Properties".It contains the broadband... -
Federal
Data for Plots in Work with Title: A Measurement-Referenced Error Vector Magnitude for Counterfeit Cellular Device Detection
Department of Commerce —
The raw data from this experiment are recorded voltage waveforms versus time from a calibrated equivalent time sampling oscilloscope, touchstone files from network... -
Federal
Additive Manufacturing Benchmark 2022 Schema
Department of Commerce —
This resource is the implementation in XML Schema [1] of a data model that describes the Additive Manufacturing Benchmark 2022 series data. It provides a robust set... -
Federal
Data for manuscript: Beating thermal noise in a dynamic signal measurement by a nanofabricated cavity-optomechanical sensor.
Department of Commerce —
'Beating thermal noise in a dynamic signal measurement by a nanofabricated cavity-optomechanical sensor', Mingkang Wang, Diego J. Perez-Morelo, Georg Ramer, Georges... -
Federal
Data for the manuscript: Integrating planar photonics for multi-beam generation and atomic clock packaging on chip.
Department of Commerce —
Experimental and modeling data from the manuscript: 'Integrating planar photonics for multi-beam generation and atomic clock packaging on chip', C. Ropp, et.al.,...