{"@type": "dcat:Dataset", "accessLevel": "public", "bureauCode": ["009:25"], "contactPoint": {"@type": "vcard:Contact", "fn": "NIH/NCBI Data Team", "hasEmail": "mailto:info@ncbi.nlm.nih.gov"}, "description": "A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5 - 10.0 wt% of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01 - 10.0 wt% of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.", "distribution": [{"@type": "dcat:Distribution", "description": "Access the complete Patent AT-E400395-T1: [Translated] SOLDER PASTES on the official website.", "downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E400395-T1", "mediaType": "text/html", "title": "Official Data Source"}], "identifier": "https://healthdata.gov/api/views/t2aq-9stu", "issued": "2025-09-05", "keyword": ["chemistry", "innovation", "patent", "pubchem", "research"], "landingPage": "https://healthdata.gov/d/t2aq-9stu", "modified": "2025-09-06", "programCode": ["009:066"], "publisher": {"@type": "org:Organization", "name": "National Center for Biotechnology Information (NCBI)"}, "theme": ["NIH"], "title": "Patent AT-E400395-T1: [Translated] SOLDER PASTES"}