{"@type": "dcat:Dataset", "accessLevel": "public", "bureauCode": ["009:25"], "contactPoint": {"@type": "vcard:Contact", "fn": "NIH/NCBI Data Team", "hasEmail": "mailto:info@ncbi.nlm.nih.gov"}, "description": "The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has,,been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a-zinc-copper-tin ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105\u00b0 C.-200\u00b0 C.", "distribution": [{"@type": "dcat:Distribution", "description": "Access the complete Patent AT-E401767-T1: [Translated] SURFACE TREATED COPPER FOIL AND PRODUCTION THEREOF AND COPPER CLADDED LAMINATE THEREOF on the official website.", "downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E401767-T1", "mediaType": "text/html", "title": "Official Data Source"}], "identifier": "https://healthdata.gov/api/views/s2qj-g84i", "issued": "2025-09-05", "keyword": ["chemistry", "innovation", "patent", "pubchem", "research"], "landingPage": "https://healthdata.gov/d/s2qj-g84i", "modified": "2025-09-06", "programCode": ["009:066"], "publisher": {"@type": "org:Organization", "name": "National Center for Biotechnology Information (NCBI)"}, "theme": ["NIH"], "title": "Patent AT-E401767-T1: [Translated] SURFACE TREATED COPPER FOIL AND PRODUCTION THEREOF AND COPPER CLADDED LAMINATE THEREOF"}