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  "contactPoint": {
    "fn": "Aaron M. Forster",
    "hasEmail": "mailto:aaron.forster@chips.gov"
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  "description": "The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225",
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      "title": "README"
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  "identifier": "ark:/88434/mds2-2948",
  "issued": "2023-03-10",
  "keyword": [
    "advanced packaging",
    "differential scanning calorimetry",
    "filled polymers",
    "glass transition",
    "heat of reaction",
    "semiconductors",
    "thermal gravimetric analysis",
    "thermosets"
  ],
  "landingPage": "https://data.nist.gov/od/id/mds2-2948",
  "language": [
    "en"
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  "license": "https://www.nist.gov/open/license",
  "modified": "2023-03-01 00:00:00",
  "programCode": [
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  "publisher": {
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    "name": "National Institute of Standards and Technology"
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  "references": [
    "https://doi.org/10.1109/ECTC51909.2023.00225"
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  "theme": [
    "Chemistry:Analytical chemistry",
    "Chemistry:Chemical engineering and processing",
    "Chemistry:Thermochemical properties",
    "Materials:Composites",
    "Materials:Materials characterization",
    "Materials:Polymers"
  ],
  "title": "Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan"
}