Large Format Uncooled Focal Plane Array Project

Metadata Updated: July 8, 2015

Black Forest Engineering has identified innovative modifications in uncooled focal plane array (UFPA) architecture and processing that allows development of large format long wavelength infrared (8-14 ?m) imaging sensors to meet future NASA system requirements for a light weight, low power, and radiation tolerant imager. These modifications allow development of bolometer-based large format UFPA, with a pixel pitch of 20-?m and 1024x768 pixel elements with sensitivity comparable to commercially available UFPAs with 30-?m pixel pitch. The identified modifications are applicable to amorphous silicon bolometer-based UFPAs, such as those manufactured by Raytheon Commercial Infrared in Dallas, Texas.

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Public: This dataset is intended for public access and use. License: U.S. Government Work

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Metadata Created Date April 9, 2015
Metadata Updated Date July 8, 2015

Metadata Source

Harvested from NASA Data.json

Additional Metadata

Resource Type Dataset
Metadata Created Date April 9, 2015
Metadata Updated Date July 8, 2015
Publisher Space Technology Mission Directorate
Unique Identifier TECHPORT_5072
Maintainer Email
Id {$oid: 55942a90c63a7fe59b498821}
Public Access Level public
Bureau Code 026:00
Metadata Context
Schema Version
Catalog Describedby
Harvest Object Id 72fd1ec1-1459-4bad-aae2-8ad23468ccd8
Harvest Source Id 39e4ad2a-47ca-4507-8258-852babd0fd99
Harvest Source Title NASA Data.json
Data First Published 2004-11-01T00:00:00Z
Homepage URL
Language en-US
Data Last Modified 2015-03-12
Program Code 026:027
Publisher Hierarchy National Aeronautics and Space Administration > Space Technology Mission Directorate
Related Documents,,,,,,,
Source Datajson Identifier True
Source Hash 8cefe7e887b85ce7ea664019df35495137fa75c3
Source Schema Version 1.1
Temporal 2004-11-01T00:00:00Z/2006-06-01T00:00:00Z

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