High Thermal Conductivity Functionally Graded Heat Sinks for High Power Packaging, Phase I

Metadata Updated: May 2, 2019

This NASA SBIR Phase I program proposes the development of a high thermal conductivity (400 W/mK), low coefficient of thermal expansion (7-10 ppm/?K), and light weight (3-4 g/cm3) functionally graded material (FGM) heat sinks for microelectronic packaging applications. The uniquely defined ?FGM concept? pursued in this project uses a metallic package base that consists of a light metal matrix composite material to provide low thermal expansion and a high thermal conductivity functional core to cool the high power semiconductor die. The thermal performance of the heat sink is doubled by using the high thermal conductivity functional core bonded through the body of the heat sink.

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Public: This dataset is intended for public access and use. License: U.S. Government Work

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Metadata Created Date August 1, 2018
Metadata Updated Date May 2, 2019

Metadata Source

Harvested from NASA Data.json

Additional Metadata

Resource Type Dataset
Metadata Created Date August 1, 2018
Metadata Updated Date May 2, 2019
Publisher Space Technology Mission Directorate
Unique Identifier TECHPORT_5249
Maintainer Email
Public Access Level public
Bureau Code 026:00
Metadata Context https://project-open-data.cio.gov/v1.1/schema/catalog.jsonld
Metadata Catalog ID https://data.nasa.gov/data.json
Schema Version https://project-open-data.cio.gov/v1.1/schema
Catalog Describedby https://project-open-data.cio.gov/v1.1/schema/catalog.json
Datagov Dedupe Retained 20190501230127
Harvest Object Id 43d85fb3-d446-45ac-b71b-b46ae5defe4b
Harvest Source Id 39e4ad2a-47ca-4507-8258-852babd0fd99
Harvest Source Title NASA Data.json
Data First Published 2004-07-01
Homepage URL https://techport.nasa.gov/view/5249
License http://www.usa.gov/publicdomain/label/1.0/
Data Last Modified 2018-07-20
Program Code 026:027
Source Datajson Identifier True
Source Hash 5e2e188a9c9969c217ecfdd53b9c47643d308f0b
Source Schema Version 1.1

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