High-Temperature, Wirebondless, Ultra-Compact Wide Bandgap Power Semiconductor Modules for Space Power Systems, Phase I

Metadata Updated: May 2, 2019

Silicon carbide (SiC) and other wide band-gap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultra-high power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high temperature device packaging technology. The objective of this proposed research is to develop a ultra-compact, hybrid power module packaging technology based on the use of double leadframes and direct leadframe-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450oC. The Phase I research plan will include: 1) material selection; 2) electrical, mechanical, and thermal design of a half-bridge prototype module; 3) packaging process development using volume manufacturing processes; 4) stress and thermal modeling and analysis; 5) material characterization under high temperature and high temperature cycling; and 6) cost estimation and comparative analysis with competing technologies. The unique advantages of this innovative solution include very high current carrying capability, low package parasitic impedance, low thermo-mechanical stress at high temperatures, double-side cooling, and modularity for easy system-level integration. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art.

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Public: This dataset is intended for public access and use. License: U.S. Government Work

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Metadata Created Date August 1, 2018
Metadata Updated Date May 2, 2019

Metadata Source

Harvested from NASA Data.json

Additional Metadata

Resource Type Dataset
Metadata Created Date August 1, 2018
Metadata Updated Date May 2, 2019
Publisher Space Technology Mission Directorate
Unique Identifier TECHPORT_8929
Maintainer
TECHPORT SUPPORT
Maintainer Email
Public Access Level public
Bureau Code 026:00
Metadata Context https://project-open-data.cio.gov/v1.1/schema/catalog.jsonld
Metadata Catalog ID https://data.nasa.gov/data.json
Schema Version https://project-open-data.cio.gov/v1.1/schema
Catalog Describedby https://project-open-data.cio.gov/v1.1/schema/catalog.json
Datagov Dedupe Retained 20190501230127
Harvest Object Id 968f04d3-9f77-4fd7-88ae-27f8dd734391
Harvest Source Id 39e4ad2a-47ca-4507-8258-852babd0fd99
Harvest Source Title NASA Data.json
Data First Published 2010-07-01
Homepage URL https://techport.nasa.gov/view/8929
License http://www.usa.gov/publicdomain/label/1.0/
Data Last Modified 2018-07-19
Program Code 026:027
Source Datajson Identifier True
Source Hash 988079bf7ff27783781ced340e75ecd96179323b
Source Schema Version 1.1

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