High-Temperature, Wirebondless, Ultra-Compact Wide Bandgap Power Semiconductor Modules for Space Power Systems, Phase II

Metadata Updated: July 17, 2020

Silicon carbide (SiC) and other wide band-gap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultra-high power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high temperature device packaging technology. The objective of this proposed research is to develop a ultra-compact, hybrid power module packaging technology based on the use of double leadframes and direct leadframe-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450 degrees Celsius. The unique advantages of this innovative solution include very high current carrying capability, low package parasitic impedance, low thermo-mechanical stress at high temperatures, double-side cooling, and modularity for easy system-level integration. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art, and capable of operating from 450C to -125C.

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Public: This dataset is intended for public access and use. License: No license information was provided. If this work was prepared by an officer or employee of the United States government as part of that person's official duties it is considered a U.S. Government Work.

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Dates

Metadata Created Date August 1, 2018
Metadata Updated Date July 17, 2020

Metadata Source

Harvested from NASA Data.json

Additional Metadata

Resource Type Dataset
Metadata Created Date August 1, 2018
Metadata Updated Date July 17, 2020
Publisher Space Technology Mission Directorate
Unique Identifier TECHPORT_9661
Maintainer
TECHPORT SUPPORT
Maintainer Email
Public Access Level public
Bureau Code 026:00
Metadata Context https://project-open-data.cio.gov/v1.1/schema/catalog.jsonld
Metadata Catalog ID https://data.nasa.gov/data.json
Schema Version https://project-open-data.cio.gov/v1.1/schema
Catalog Describedby https://project-open-data.cio.gov/v1.1/schema/catalog.json
Harvest Object Id d3ca6df8-3d82-4dc5-9ee7-6fa4b8db2727
Harvest Source Id 39e4ad2a-47ca-4507-8258-852babd0fd99
Harvest Source Title NASA Data.json
Data First Published 2013-05-01
Homepage URL https://techport.nasa.gov/view/9661
Data Last Modified 2020-01-29
Program Code 026:027
Source Datajson Identifier True
Source Hash af5b717ce088fa8e5fe36ff598fdb3f8b3210eb5
Source Schema Version 1.1

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