Heterogeneous Chip Integration for GHz Systems, Phase I

Metadata Updated: February 28, 2019

Indiana Integrated Circuits, LLC (IIC) proposes to develop the customizable, high-performance microchip interconnect technology called Quilt Packaging (QP) to address NASA's requirement for high performance integration of heterogeneous microwave systems. QP is an affordable, scalable, patented edge-interconnect technology for joining microchips of disparate materials and/or process technologies into monolithic-like systems that perform electrically as if they were one chip. QP enables sub-micron chip-to-chip alignment, extremely small (< 10 micron) chip-to-chip gaps, and can be implemented in multiple substrate materials, including SiGe, GaAs, Si, InP, GaSb, SiC, GaN, and more. Quilt Packaging can enable extremely low-loss, wide-bandwidth integration of MMIC modules comprising disparate material systems and/or process technologies. QP has demonstrated less than 0.1 dB insertion loss up to 100 GHz, and under 1 dB out to 220 GHz. Initial reliability testing of QP chipsets have demonstrated no degradation or mechanical issues, having undergone thermal cycling from -40 C to 125 C for over 350 cycles and counting. In addition to excellent microwave performance, QP has the potential for decreasing system size, weight and power. The proposed effort will leverage previous work in GaAs and Si QP to demonstrate a heterogeneously integrated "quilted" chipset of SiGe, GaAs and/or InP chips. Resulting data from this Phase I will directly apply to the design, fabrication and demonstration of a functioning MMIC module in Phase II. Throughout Phase I consideration will be given to NASA system needs and transition to production-level Quilt Package chip fabrication with commercialization partners Research Triangle Institute and Northrop Grumman Corp. for manufacturing scale-up of Quilt Packaging enabled MMIC modules.

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Public: This dataset is intended for public access and use. License: U.S. Government Work

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Metadata Created Date August 1, 2018
Metadata Updated Date February 28, 2019

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Harvested from NASA Data.json

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Resource Type Dataset
Metadata Created Date August 1, 2018
Metadata Updated Date February 28, 2019
Publisher Space Technology Mission Directorate
Unique Identifier TECHPORT_17889
Maintainer
TECHPORT SUPPORT
Maintainer Email
Public Access Level public
Bureau Code 026:00
Metadata Context https://project-open-data.cio.gov/v1.1/schema/catalog.jsonld
Metadata Catalog ID https://data.nasa.gov/data.json
Schema Version https://project-open-data.cio.gov/v1.1/schema
Catalog Describedby https://project-open-data.cio.gov/v1.1/schema/catalog.json
Harvest Object Id dc800e81-698b-4396-a009-aa24abba974b
Harvest Source Id 39e4ad2a-47ca-4507-8258-852babd0fd99
Harvest Source Title NASA Data.json
Data First Published 2014-12-01
Homepage URL https://techport.nasa.gov/view/17889
License http://www.usa.gov/publicdomain/label/1.0/
Data Last Modified 2018-07-19
Program Code 026:027
Source Datajson Identifier True
Source Hash 0a928081d9cbc5feb7432b7d2c801b3548ac5c34
Source Schema Version 1.1

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